INORGANIC FILLER AND ORGANIC FILLER-CONTAINING CURABLE RESIN COMPOSITION, RESIST FILM COATED PRINTED WIRING BOARD, AND METHOD FOR PRODUCING THE SAME

摘要

A curable resin composition comprises: (I) 100 parts by-weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 mum, wherein a content weight ratio of the components (II) and (III) is 1 to 41.