发明名称 ACETYLENE COMPOUND
摘要 <p>Disclosed is an acetylene compound represented by the general formula (1) below, which is useful as a raw material for fused polymers having high heat resistance. (In the formula (1), the encircled Ar represents an aryl group or a heteroaryl group; X represents a divalent linking group; R, R' and R1 each represents a hydrogen atom, a hydrocarbon group or a heterocyclic group; R2 represents a hydrogen atom or a substituent which may be substituted by a benzene ring; A represents a hydrocarbon group or a heterocyclic group; Q represents a hydrogen atom, a hydrocarbon group or a metal element capable of forming a monovalent metal salt; a represents an integer of not less than 0; and b, m and n each represents an integer of not less than 1. When all of n, m and b are 1 at the same time, X is not -(C=O)O-; and when n is 2 and both m and b are 1, X is not -O-.)</p>
申请公布号 WO2009041482(A1) 申请公布日期 2009.04.02
申请号 WO2008JP67276 申请日期 2008.09.25
申请人 FUJIFILM CORPORATION;IMAKUNI, AKIRA;NAKAYAMA, MASAYA;YAGIHARA, MORIO 发明人 IMAKUNI, AKIRA;NAKAYAMA, MASAYA;YAGIHARA, MORIO
分类号 C07C275/42;C07D209/48;C08G73/18 主分类号 C07C275/42
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