APPARATUS AND METHOD FOR FABRICATING BONDED SUBSTRATE

摘要

A junction board manufacturing equipment and a bonded substrate manufacturing method for preventing the positional deviation and a welded substrate are provided to reduce the manufacture fault of the bonded substrate. A feeding robot(31) has a first and a second feeding arm. A first and a second feeding arm carry out the upper plate and lower plate within the process chamber. The first transfer arm comprises the first retention support and the second retention support. The first retention support supports the upper plate. The second retention support supports the welded substrate of 2 each. The second transfer arm comprises the third retention support. The third retention support supports the lower plate. It absorbs the exterior of the upper plate and the first retention support supports to the horizontal direction. The first retention upholding plate comprises the groove accommodating the retention support.