| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is miniaturizable. <P>SOLUTION: This semiconductor device 50 is equipped with a sensor element 10 made of silicon formed by using MEMS technology, and a package 20 for storing the sensor element 10. The sensor element 10 includes a frame body part 11, a weight part 12 arranged inside the frame body part 11, and a bending part 13 for rockably supporting the weight part 12 on the frame body part 11. Integrated circuits 15 (15a, 15b) connected electrically to the sensor element 10 are formed on an upper surface domain 1d of the weight part 12, and on an upper surface domain 1e of the frame body part 11. <P>COPYRIGHT: (C)2009,JPO&INPIT |
