| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a platen sheet for minimizing a change of pressure distribution while preventing the thermal deformation of a platen due to heating during polishing work. <P>SOLUTION: This polishing device comprises a polishing pad 50 mounted on the platen 30, the polishing pad 50 having relative sliding contact with a wafer for polishing work while supplying slurry, the platen 30 to be rotated, and a wafer holder on which the wafer is mounted with a reduction of pressure thereon. Herein, a hard plate 41 is integrally pasted on the reverse face of an elastic sheet 40 and mounted on the platen 30 and a flexible sheet 51 is integrally pasted on the reverse face of the polishing pad 50 and mounted on the elastic sheet 40 for averaging the wafer while correcting the warpage of the wafer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
