| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid-state imaging element which can eliminate misalignment between a front surface side and a rear surface side and is accurate and reduced in cost through the reduced number of processes. SOLUTION: A support substrate 19 that is formed of a highly optical transparent material in a visible light region is bonded onto the front surface side of a semiconductor substrate 10 wherein an alignment mark 11 is formed on its front surface side, with an adhesive agent 18 formed of a highly optical transparent material in the same visible light region. When a component is formed on the rear surface side, the alignment mark 11 formed on the front surface side is recognized by a recognition device 12A for alignment. COPYRIGHT: (C)2009,JPO&INPIT
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