| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method that prevent operation failure and processing failure because of liquid adhering to a substrate in an aligner. <P>SOLUTION: After the substrate W is cleaned, a liquid layer L in the rinse liquid is formed so that one surface of the substrate W is covered. Then, a liquid supply nozzle 650 moves toward the outside from above the center of the substrate W. The liquid supply nozzle 650 stops temporarily after moving from above the center of the substrate W by a prescribed distance. In this period, the liquid layer L is parted in a thin-layer region by centrifugal force, and a dry core C is formed at the center of the liquid layer L. After that, when the liquid supply nozzle 650 moves toward the outside again, a dry region R1 with no rinse liquids is expanded on the substrate W with the dry core C as a starting point. <P>COPYRIGHT: (C)2009,JPO&INPIT |
