| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface illumination-type semiconductor light emitting device which is compact and inexpensive. <P>SOLUTION: At least two first semiconductor light emitting element arrays formed by linearly arraying a plurality of first semiconductor light emitting elements 11 are mounted on a wiring board 1. Further, a plurality of second semiconductor light emitting elements 21 are mounted on the first semiconductor light emitting element 11. A p-side electrode 35 of one second semiconductor light emitting element 21 is connected to an n-side electrode 34 of one first semiconductor light emitting element 11 disposed below it and a p-side electrode 35 of the other first semiconductor light emitting element 11, and all the first and second semiconductor light emitting elements 11 and 21 are connected in series. An n-side electrode and a p-side electrode 35 of a first semiconductor light emitting element 11 to which an n-side electrode 34 and a p-side electrode 35 of a second semiconductor light emitting element 21 are not connected, and an electrode pattern 3 formed on the wiring board 1 are wire-bonded on one side of the first semiconductor light emitting element group 10. <P>COPYRIGHT: (C)2009,JPO&INPIT |
