| 摘要 |
PROBLEM TO BE SOLVED: To provide a silica-based film forming composition capable of suppressing deposition of a deposit to a nozzle of a slit coater and to provide a method for forming a silica-based film for stably forming a silica-based film with uniform thickness on a large-area substrate by using the slit coater. SOLUTION: The silica-based film forming composition applied to a substrate by the slit coater, comprises a silicone polymer A and a solvent B including a high-boiling point solvent with a boiling point of 150°C or more. The method for forming the silica-based film uses the silica-based film forming composition. COPYRIGHT: (C)2009,JPO&INPIT
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