发明名称 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR FORMATION OF CURED FILM USING THE SAME
摘要 Disclosed is a positive-type photosensitive resin composition comprising: a resin which has a specific acrylic acid-type constituent unit whose dissociating group can be dissociated to produce a carboxyl group, which is insoluble or poorly soluble in an alkali, and whose acid-dissociating group can be dissociated to render the resin alkali-soluble; a resin which has a constituent unit having a functional group capable of reacting with a carboxyl group to form a covalent bond; and a compound which can generate an acid upon being irradiated with an active ray or an radioactive ray. The positive-type photosensitive resin composition is excellent in sensitivity, percentage residual film and storage stability. Also disclosed is a cured film produced by a cured film formation method using the positive-type photosensitive resin composition. The cured film is excellent in heat resistance, an adhesion property, transmittance and the like.
申请公布号 WO2009041619(A1) 申请公布日期 2009.04.02
申请号 WO2008JP67496 申请日期 2008.09.26
申请人 FUJIFILM CORPORATION;TAKITA, SATOSHI 发明人 TAKITA, SATOSHI
分类号 G03F7/039;G03F7/004;G03F7/40;H01L21/027 主分类号 G03F7/039
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