发明名称 |
Semiconductor device including wiring excellent in impedance matching, and method for designing the same |
摘要 |
A semiconductor device includes an interposer, and a semiconductor chip mounted on the interposer. In a plan view, the interposer includes a first region overlapping the semiconductor chip, and a second region excluding the first region. The interposer includes at least one wiring formed astride the first region and the second region. The cross-sectional area of the wiring in the first region and the cross-sectional area of the wiring in the second region are different from each other. |
申请公布号 |
US2009084592(A1) |
申请公布日期 |
2009.04.02 |
申请号 |
US20080232889 |
申请日期 |
2008.09.25 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
TSUKUDA TATSUAKI;HIRATA MASAYOSHI |
分类号 |
H05K1/18;G06F17/50 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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