发明名称 |
Laminiertes Dämpfungsbasismaterial und Dämpfungsanordnung mit Schichtung dieses Basismaterials |
摘要 |
<p>A damping structure which dispenses of the connection of a resistor used for a conventional damping structure and undergoes diverse molding processings with a simpler structure, and a laminate damping base material constituting such a damping structure. A laminate damping base material made of a piezoelectric ceramic material or piezoelectric polymer material and a conductive fiber-reinforced plastic (FRP) composition is prepared. One to a plurality of this base material are stacked to constitute a first damping structure. A second damping structure is constituted by stacking at least a layer of piezoelectric polymer film or piezoelectric ceramic thin film between a multilayer laminate that is a laminate of conductive laminate FRP base materials.</p> |
申请公布号 |
DE10297295(B4) |
申请公布日期 |
2009.04.02 |
申请号 |
DE2002197295 |
申请日期 |
2002.08.09 |
申请人 |
TANIMOTO, TOSHIO;KURIMOTO LTD.;KIMURA, TOSHIO |
发明人 |
TANIMOTO, TOSHIO |
分类号 |
B32B27/14;E04B1/82;B29C70/08;B32B7/02;B32B18/00;B32B27/04;E04B1/98;E04C2/20;F16F15/00;F16F15/02 |
主分类号 |
B32B27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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