| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist substrate and contact exposure method that improve conditions of extension in exposure time and decrease in resolution, while preventing resist deposition on a photomask after exposure, and also perform good exposure even on the occurrence of surge on a surface of a resist layer and deposition of contamination, or mixing of air bubbles. <P>SOLUTION: The resist substrate 4 is characterized in that the resist layer 2 is formed on the substrate 1 and a photomask layer 3 adheres on an upper surface of the resist layer 2. <P>COPYRIGHT: (C)2009,JPO&INPIT |
