| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer loading mechanism capable of suppressing deposition of film. SOLUTION: The wafer loading mechanism comprises: a heater plate 21 having a wafer loading face 21a which has a first lift pin insertion hole 81a having a large diameter part 94b and a small diameter part 94a while a heating element for heating a wafer W to be processed to the film deposition temperature is embedded therein; a temperature control jacket which is formed to cover a surface at least other than the wafer loading face 21a, and is provided with a second lift pin insertion hole 81c having a large diameter part 92b and a small diameter part 92a while the temperature is the non-film deposition temperature below the film deposition temperature; a first lift pin 24b-1 which is provided with a cover 93b to be inserted in the large diameter part 94b and a shaft part 93a to be inserted in both the large diameter part 94b and the small diameter part 94a; and a second lift pin 24b-2 which is provided with a cover 91b to be inserted in the large diameter part 92b and a shaft part 91a to be insertable in both the large diameter part 92b and the small diameter part 92a. COPYRIGHT: (C)2009,JPO&INPIT
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