| 摘要 |
An apparatus for semiconductor wafer transfer comprises a first region for placement of a pod, a second region for placement of a cassette, an unloading mechanism, and a transferring mechanism for transferring wafers in the unloaded pod to the cassette horizontally. In an embodiment, the pod is unloaded by lifting the housing of the pod, and preferably the apparatus for movement of semiconductor wafers further comprises a carrying mechanism for moving the cassette toward the pod, so that the cassette can be closer to the pod for smoothing wafer transfer.
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