发明名称 |
CIRCUIT DEVICE, CIRCUIT MODULE, AND OUTDOOR UNIT |
摘要 |
Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.
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申请公布号 |
US2009086431(A1) |
申请公布日期 |
2009.04.02 |
申请号 |
US20080239286 |
申请日期 |
2008.09.26 |
申请人 |
SANYO ELECTRIC CO., LTD.;SANYO SEMICONDUCTOR CO., LTD. |
发明人 |
SAKAMOTO HIDEYUKI;SAITO HIDEFUMI;KOIKE YASUHIRO;TSUKIZAWA MASAO |
分类号 |
H05K7/00;H05K7/20 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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