Paste composition, insulating film, multilyer interconnection structure, printed-circuit board, image display device, and manufacturing method of paste composition

摘要

A disclosed paste composition includes a filler and a resin. The filler includes insulating filling material particles made of at least one of silica and titania, and insulating particles made of at least one of silica and titania whose surfaces have been hydrophobic treated, or insulating particles having at least their surfaces made of a material other than silica or titania. The volume of the insulating filling material particles is more than or equal to 20% of the total volume of the filler and less than or equal to 80% of the total volume of the filler.