COMPOSITION OF SEMICONDUCTOR DEVICE ATTACHING PASTE

摘要

An adhesive paste composition for manufacturing a semiconductor device is provided to prevent the composition from being over-hardened by controlling the kind and content of a curing accelerator. An adhesive paste composition for manufacturing a semiconductor device comprises epoxy resin, inorganic filler, organic filler and plasiticizer. The adhesive paste composition for manufacturing a semiconductor device further comprises a latent hardener of 5-20 parts by weight based on the composition of 100.0 parts by weight and a hardening accelerator of 0.1-1 parts by weight based on the latent hardener 100.0 parts by weight. The latent handener is a phenol-based or acid anhydride-based material. The hardening accelerator is a mixture of one or at least two selected from imidazol-based, phosphine-based and amine-based materials.