FEATURE PREDICTION METHOD, PHOTOMASK MANUFACTURING METHOD, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND RECORDING MEDIUM FOR RECORDING FEATURE PREDICTION PROGRAM

摘要

A feature prediction method, a photomask manufacturing method, an electronic component manufacturing method, and a recording medium for recording the feature prediction program are provided to implement the prefer transfer pattern on a wafer by amending readily the interior of photomask mask pattern. A feature prediction method includes the step of calculating the incident angle(S101); the step of calculating the incident amount; the step of calculating the incident amount distribution; the step of selecting the feature predicted point(S102); the step of predicting the feature(S103). The incident angle is calculated based on design pattern data. The incident amount is calculated based on the incident angle and the process condition data. The incident quantity distribution is calculated based on the incident amount.