摘要 |
817,746. Semi-conductor devices. BROWN, BOVERI & CIE A.G..June 24, 1957 [June 29, 1956], No. 19796/56. Class 37. A cooling device for a semi-conductor cell contained in a vessel having a metallic wall comprises a base-plate soldered to the wall and carrying fins which have elongated. depressions arranged so that a depression in one fin is oppositely inclined and extends across a depression in an adjacent fin. In one embodiment, a germanium rectifier 2, Fig. 1, in a vessel 1, is soldered to a metallic wall 3 which comprises a vacuum envelope 3a brazed to a copper disc 3b to which is soldered base-plate 5 carrying fins 6 having depressions 7. Each fin is in contact with the following fin and the depressions are inclined as shown in Fig. 2. To avoid thermal overloading the cooler may be joined to the vessel by solder which has a melting-point below the maximum admissible operating temperature, so that by means of a spring device the current may be cut off when the solder melts. |