发明名称 INTEGRATED CIRCUIT DISTRIBUTED OVER AT LEAST TWO NON-PARALLEL PLANES AND ITS METHOD OF PRODUCTION
摘要 An integrated circuit includes a first plate-shaped part and at least a plate-shaped second part separate from the first part and attached to the first part by deformable mechanical connection defining a non-zero angle with the first part. A method of producing the integrated circuit includes depositing deformable connecting means in contact with a first portion of the structure and a second portion of the structure, etching the structure to separate the first portion and the second portion, relatively moving the first and second portions to deform the connecting means and fastening together the first portion and the second portion.
申请公布号 EP2041022(A1) 申请公布日期 2009.04.01
申请号 EP20070823279 申请日期 2007.07.11
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE 发明人 ALBERTINI, JEAN-BAPTISTE
分类号 B81B7/00;G01R33/02 主分类号 B81B7/00
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