WIRING BOARD AND SOLID-STATE IMAGING DEVICE

摘要

Provided are a wiring board capable of mounting either a frontside incident type solid-state imaging element and a backside incident type solid-state imaging element and a solid-state imaging device. The wiring board 1 is a wiring board having a to-be-arranged region 1a at which the solid-state imaging element is arranged, and is provided with a plurality of first electrode pads 12 formed inside the to-be-arranged region 1a and a plurality of second electrode pads 13 formed outside the to-be-arranged region 1a, each of which is electrically connected to each of the first electrode pads 12. Further, the solid-state imaging device mounts the backside incident type solid-state imaging element or the frontside incident type solid-state imaging element on the wiring board 1.