| 摘要 |
The invention relates to a first method of bonding a first substrate to a second substrate, comprising the steps of a) applying an UV-curable adhesive resin composition comprising a photolatent base to at least one transparent surface of at least one of said first and second substrates, b) bringing said first and second substrates together with said adhesive composition there between, c) exposing said adhesive composition to actinic radiation to effect curing or alternatively to a second method of bonding a first substrate to a second substrate, comprising the steps of a) applying a UV-curable adhesive resin composition comprising a photolatent base to one surface, b) exposing said adhesive composition to actinic radiation to effect curing, c) bringing said first and second substrates together with said adhesive composition there between. |
