LIGHT EMITTING DIODE PACKAGE

摘要

A light-emitting diode package is provided to obtain the efficient optical alignment by increasing the freedom degree for utilizing the wide lens surface. A package body(110) comprises a concave part(112) consisting of the cavity having the space of the constant size. A light emitting diode chip(130) is installed at the bottom surface of the concave part. The light emitting diode chip is electrically connected to the lead frame through the wire. A resin shield part(140) is formed in the concave part and seals the light emitting diode chip. The side wall(114) that surrounds the concave part is made of transparent materials. The side wall supports a lead frame(120).