| 摘要 |
<p>A substrate such as a printed wiring board defines a cutout of grounding metallization. A monopole radiating element is spaced laterally from edges of the grounding metallization in the cutout. A patch radiating element is spaced laterally from edges of the grounding metallization in the cutout. The monopole and patch radiating elements overlie at least a portion of one another to enable inductive coupling through an aperture characterized by the absence of grounding metallization, and the patch radiating element is shorted at a corner to the grounding metallization.</p> |
