| 摘要 |
A substrate transport apparatus is provided to effectively prevent the secession of substrate from the finger without the disturbance of the movement of the finger. A substrate transport apparatus(100) comprises a blade(110), a driving part(120), and a separation protection part(130). The blade supports the semiconductor substrate. The blade comprises a plate(112), a forward support projection(114), and a rearward support projection(116). The driving part moves the plate back and forth. The driving part converts the traveling direction of the plate by rotating the plate in the rotational direction(R). The separation protection part prevents the secession of the wafer during the wafer transfer process.
|
