LED PACKAGE WITH ITS INTERFACIAL DELAMINATION REDUCED

摘要

An LED package reducing the interfacial delamination is provided to suppress the interfacial separation phenomenon between the lead frame and the encapsulating material. An LED package(1) comprises a base(12) consisting of the first and second lead frames(12a,12b). An LED chip(2) is mounted to the first lead frame. Electrode of the LED chip and the second lead frame are electrically connected by a bonding wire(3). A reflector(20) defining a cavity(21) in the LED chip neighboring is formed on the upper side of the base. The reflector is formed by molding the opaque epoxy or the PPA resin. A groove(121) of annular is built up in the base. The groove is filled up with resin during the molding process of reflector. The cavity is filled with the light-passing resin. An encapsulating material(30) is formed in order to protect the LED chip from outside.