发明名称 SIDE-VIEW LIGHT EMITTING DIODE PACKAGE AND BACK LIGHT UNIT MODULE USING THE SAME
摘要 A side-view light emitting diode package and a back light unit module using the same are provided to suppress the thickness increase of the side LED package by adhering the lens having the fresnell pattern. A side LED package(1) comprises a pair of the lead terminals including the first and the second lead terminals(11,13). The first and the second lead terminals are supported by a package body(15). The package body is classified into the top package main body and the bottom package main body. The top package main body has a cavity(16) exposing the first and the second lead terminals. The built-in region of a LED chip(17) is exposed by the cavity. The lens is located in the stepped pulley part(161) of the upper end of cavity. The first and the second lead terminals are located in the floor of the cavity. The LED chip is installed inside the cavity. The LED chip is electrically connected to the second lead terminal by a bonding wire(19).
申请公布号 KR20090032813(A) 申请公布日期 2009.04.01
申请号 KR20070098343 申请日期 2007.09.28
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 KIM, TAE KWANG;KIM, DO HYUNG
分类号 H01L33/58;H01L33/52 主分类号 H01L33/58
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