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发明名称
加压成形装置
摘要
提供可降低贴合基板之制造不良的贴合基板制造装置。在处理室(71)内于大气压,以上平板(72a)及下平板(72b)以真空吸着来吸着保持基板(W1、W2),而在处理室内于减压下对各平板施加电压而以静电吸着来分别吸着保持。而从大气压下切换至减压下时,使用以吸着保持基板之背压等压于处理室内的压力。藉此,可防止基板之掉落、移动而降低基板之贴合不良。
申请公布号
TW200914920
申请公布日期
2009.04.01
申请号
TW097117814
申请日期
2001.11.28
申请人
富士通股份有限公司
发明人
桥诘幸司;宫良政;羽田野宪彦;门彻二
分类号
G02F1/133(2006.01)
主分类号
G02F1/133(2006.01)
代理机构
代理人
恽轶群;陈文郎
主权项
地址
日本
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