| 摘要 |
A light emitting device is provided to improve the uniformity of the brightness distribution by setting up the light emitting diode chip to the uniform height. A resin portion(14) covers the region except for the region facing the electrode forming surface of a light emitting diode chip(11). A transparent resin layer(15) is formed in the side facing the electrode forming surface. The resin is formed of the white color resin. The thickness of the resin portion is appropriately controlled by considering the space arranged in the backlight and the reflecting functions. The total thickness of the LCP substrate(12) and the resin portion is 1.0mm. The white color resin is formed of the silicon resin including TiO2. The first and second wiring structures are arranged in the LCP substrate. The first and second wiring structures are electrically connected to electrodes(11a,11b) of the light emitting diode chip. |
