SEMICONDUCTOR PACKAGE AND THE MOTHODS FOR FABRICATING THE SAME

摘要

A semiconductor package and a method of manufacture thereof are provided to make the semiconductor package product which is stable in the dynamic structure by lowering the height of the total package. A top package(100b) is laminated on a bottom package(100a). A substrate(110b) of the top package directly contacts with an encapsulating material(150a) of the bottom package. A bonding layer is interposed between the substrate of the top package and the molding compound of the bottom package. A connection part(180) electrically connects the laminated top package and the bottom package. The connection part is located in the side of the bottom package and the top package.