发明名称 |
ELECTROLESS GOLD PLATING SOLUTION AND METHOD FOR ELECTROLESS GOLD PLATING |
摘要 |
<p>The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution. <IMAGE></p> |
申请公布号 |
EP1338675(A4) |
申请公布日期 |
2009.04.01 |
申请号 |
EP20010965688 |
申请日期 |
2001.09.18 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKAHASHI, AKIO;YAMAMOTO, HIROSHI;NAKAJIMA, SUMIKO;HASEGAWA, KIYOSHI;MURAKAMI, KANJI |
分类号 |
C23C18/44;(IPC1-7):C23C18/44 |
主分类号 |
C23C18/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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