| 摘要 |
<p>A jumper chip component of the present invention includes a connection conductor (3) formed of a conductive layer over an upper face (1a) and opposite side faces (1b,2b) of an insulating substrate (A), and a conductive material (4) formed of a conductive layer (4a) between plates (1,2) of the insulating substrate (A) and on a side face at the corner (4c) of the insulating substrate (A) so as not to be electrically connected to the connection conductor (3). Since the conductive material (4) formed between the plates (1,2) of the insulating substrate (A) opposes the connection conductor (3) formed on the upper face (1a) of the insulating substrate (A), the connection conductor (3) formed on the upper face (1a) of the insulating substrate (A) and a second conductive pattern (7) disposed under the insulating substrate (A) are shielded from each other by the conductive material (4), and good isolation is possible. <IMAGE></p> |
