| 摘要 |
<p>An overlay vernier and a method for fabricating a semiconductor device using the same are provided to measure the movement degree of the focus identifying mark located in the wafer outer ring by arranging the focus identifying marks having the pattern of the wedge shape. A focus identifying mark(100) comprises a mother vernier(120) of the box type. A daughter vernier(130) having designated line width is formed in the inner side of the focus identifying mark. A photosensitive film is formed on the top of the interlayer substance including the mother vernier. The photosensitive pattern which is the daughter vernier is formed by the exposure and development process. The length of the wedge pattern is changed according to the focus variation. The pattern length is short as the out of focus becomes severe.</p> |
