发明名称 |
WIRING BOARD |
摘要 |
There is provided a wiring board. The wiring board includes: a semiconductor substrate having a through hole and covered with an insulating film; a through electrode formed in the through hole; a first wiring connected to one end of the through electrode; and a second wiring connected to the other end of the through electrode. The semiconductor substrate includes: a semiconductor element and a first guard ring formed to surround the through hole. The semiconductor element includes a first conductivity-type impurity diffusion layer having a different conductivity-type from that of the semiconductor substrate and is electrically connected to the first wiring and the second wiring.
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申请公布号 |
US2009085164(A1) |
申请公布日期 |
2009.04.02 |
申请号 |
US20080241238 |
申请日期 |
2008.09.30 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD.;TOKO, INC. |
发明人 |
MURAYAMA KEI;NAKAJIMA SHINJI |
分类号 |
H01L21/768;H01L23/538;H01L29/866 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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