发明名称 METHOD FOR HORIZONTAL INSTALLATION OF LGA SOCKETED CHIPS
摘要 Method and apparatus for installing a processor into electronic communication with a socket. The land grid array socket connector includes a socket housing secured to a circuit board and an array of upwardly extending pins for electronic communication with contact pads on the processor. The socket connector provides a carriage configured to receiving the processor through a lateral opening and support a perimeter edge of the processor. A mechanical linkage couples the carriage and the socket housing for substantially vertically translating the processor relative to the socket. A plurality of alignment features upwardly extends from the socket housing along the perimeter of the array of pins. Each of the alignment features has an inwardly-facing tapered surface for registering the edge of the processor and biasing the processor into a position where the array of contact pads are aligned with the array of pins as the processor is lowered.
申请公布号 US2009088008(A1) 申请公布日期 2009.04.02
申请号 US20070865819 申请日期 2007.10.02
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BANDHOLZ JUSTIN POTOK;HINKLE JONATHAN RANDALL;KERR CLIFTON EHRICH;NATIONS, JR. JOHN FRANK;SOMMERVILLE WILLIAM JAMES
分类号 H01R12/16;H01R13/62 主分类号 H01R12/16
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