发明名称 |
METHOD FOR HORIZONTAL INSTALLATION OF LGA SOCKETED CHIPS |
摘要 |
Method and apparatus for installing a processor into electronic communication with a socket. The land grid array socket connector includes a socket housing secured to a circuit board and an array of upwardly extending pins for electronic communication with contact pads on the processor. The socket connector provides a carriage configured to receiving the processor through a lateral opening and support a perimeter edge of the processor. A mechanical linkage couples the carriage and the socket housing for substantially vertically translating the processor relative to the socket. A plurality of alignment features upwardly extends from the socket housing along the perimeter of the array of pins. Each of the alignment features has an inwardly-facing tapered surface for registering the edge of the processor and biasing the processor into a position where the array of contact pads are aligned with the array of pins as the processor is lowered.
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申请公布号 |
US2009088008(A1) |
申请公布日期 |
2009.04.02 |
申请号 |
US20070865819 |
申请日期 |
2007.10.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BANDHOLZ JUSTIN POTOK;HINKLE JONATHAN RANDALL;KERR CLIFTON EHRICH;NATIONS, JR. JOHN FRANK;SOMMERVILLE WILLIAM JAMES |
分类号 |
H01R12/16;H01R13/62 |
主分类号 |
H01R12/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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