发明名称 |
Method of manufacturing a wiring substrate, method of manufacturing an electro-optical device, method of manufacturing an electronic apparatus |
摘要 |
An etching method of the invention includes arranging droplets including a film-forming material on a substrate, drying each of the droplets to form a dry film having a width smaller than the diameter of each droplet at the time of the arrangement, and performing etching while using the dry film as an etching protective film.
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申请公布号 |
US7510093(B2) |
申请公布日期 |
2009.03.31 |
申请号 |
US20050200162 |
申请日期 |
2005.08.10 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
AOKI TAKASHI;MASUDA TAKASHI;TANAKA HIDEKI;YUDASAKA ICHIO |
分类号 |
H01B13/00;H01L21/302 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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