发明名称 Method of manufacturing a wiring substrate, method of manufacturing an electro-optical device, method of manufacturing an electronic apparatus
摘要 An etching method of the invention includes arranging droplets including a film-forming material on a substrate, drying each of the droplets to form a dry film having a width smaller than the diameter of each droplet at the time of the arrangement, and performing etching while using the dry film as an etching protective film.
申请公布号 US7510093(B2) 申请公布日期 2009.03.31
申请号 US20050200162 申请日期 2005.08.10
申请人 SEIKO EPSON CORPORATION 发明人 AOKI TAKASHI;MASUDA TAKASHI;TANAKA HIDEKI;YUDASAKA ICHIO
分类号 H01B13/00;H01L21/302 主分类号 H01B13/00
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