METHOD OF FABRICATING CARRIER AND CORELESS SUBSTRATE MANUFACTURED THEREOF

摘要

A method of fabricating a carrier and a coreless substrate manufactured thereof are provided to simplify the carrier manufacturing process by omitting the additional alkali etching for the copper film removal of the pad surface. A structure including a plurality of solder pads is formed on the surface of the first carrier phase. The second carrier consisting of a substrate, the release film(211), an adhesive(222) and a reinforcing material(223) is formed. The structure formed between the second carrier and the first carrier is cut. The insulating layer of the first carrier is peeled off from copper foils(120,130). The copper foil is removed by the alkali etching. The semiconductor die is mounted on the solder pad of the second carrier. The release film is exposed to the atmosphere by cutting the lateral side of the substrate.