发明名称 Circuit board with a perforated structure for disposing a heat pipe
摘要 A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first side of the substrate m, and a heat pipe installed on the substrate and passing through the opening. A first end of the heat pipe is connected to the first thermal module, and a second end of the heat pipe is connected to the second thermal module.
申请公布号 US7511947(B2) 申请公布日期 2009.03.31
申请号 US20060566236 申请日期 2006.12.04
申请人 MICRO-STAR INT'L CO., LTD. 发明人 LENG YAO-SHIH;HUANG YAO-YI;YANG SHANG-CHIH
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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