| 摘要 |
Disclosed is a packaged semiconductor device. The device includes a die with an active surface having a plurality of electrical contacts, a back surface located opposite the active surface, and a plurality of side surfaces. The device also includes a first light blocking protective coating that covers at least a portion of the side surfaces of the die. Also, disclosed is a semiconductor wafer including an active surface and a back surface, the active surface having a multiplicity of electrical contacts. The wafer includes a plurality of channels formed in the active surface of the wafer, the channels being arranged in a grid that effectively divide the wafer into a plurality of dice, each die having a plurality of the electrical contacts; and a light blocking filler material that fills the channels. Further, disclosed is a stamp suitable for applying a light blocking filler material into grooves on a semiconductor wafer. The stamp includes a base plate; and a multiplicity of spaced apart fins arranged in a matrix of lines that define a grid sized to match the spacing of saw streets in an associated semiconductor wafer, each line of the matrix having a series of spaced apart fins. Next, disclosed is a wafer level method of packaging integrated circuits. The wafer level method includes cutting a matrix of channels in a semiconductor wafer; dispensing a light blocking filler material into the channels; and dicing the semiconductor wafer by cutting the wafer along the channels and through the light blocking filler material, wherein the dicing cuts are narrower than the channels such that some of the light blocking filler material covers at least portions of side walls of the dice that are singulated by the dicing operation. |
