发明名称 |
LASER DRILLED SURFACES FOR SUBSTRATE PROCESSING CHAMBERS |
摘要 |
A SUBSTRATE [110] PROCESSING CHAMBER [100] HAS A COMPONENT HAVING A SURFACE THAT IS EXPOSED INSIDE THE CHAMBER [100]. THE EXPOSED SURFACE CAN HAVE A PATTERN OF RECESSES THAT ARE SPACED APART FROM ONE ANOTHER, EACH RECESS HAVING AN OPENING, SIDEWALLS [130], AND A BOTTOM WALL [135]. THE RECESSES ARE FORMED BY DIRECTING A PULSED LASER BEAM ONTO A POSITION ON A SURFACE OF THE STRUCTURE FOR A TIME SUFFICIENTLY LONG TO VAPORIZE A PORTION OF THE STRUCTURE AT THAT POSITION. THE COMPONENT CAN ALSO BE A GAS DISTRIBUTOR HAVING AN ENCLOSURE WITH PLURALITY OF LASER DRILLED GAS OUTLETS [265] HAVING FIRST AND SECOND OPENINGS WITH DIFFERENT DIAMETERS TO REDUCE AN INGRESS OF A PLASMA INTO THE ENCLOSURE. THE LASER DRILLED GAS OUTLETS [265] CAN ALSO HAVE ROUNDED EDGES. |
申请公布号 |
MY137727(A) |
申请公布日期 |
2009.03.31 |
申请号 |
MY2003PI01274 |
申请日期 |
2003.04.07 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
WANG, HONG;HE, YONGXIANG;LIN, YIXING;WELDON, EDWIN CHARLES;STOW, CLIFFORD |
分类号 |
B23K26/38;C23C16/44;H01J37/32 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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