发明名称 LASER DRILLED SURFACES FOR SUBSTRATE PROCESSING CHAMBERS
摘要 A SUBSTRATE [110] PROCESSING CHAMBER [100] HAS A COMPONENT HAVING A SURFACE THAT IS EXPOSED INSIDE THE CHAMBER [100]. THE EXPOSED SURFACE CAN HAVE A PATTERN OF RECESSES THAT ARE SPACED APART FROM ONE ANOTHER, EACH RECESS HAVING AN OPENING, SIDEWALLS [130], AND A BOTTOM WALL [135]. THE RECESSES ARE FORMED BY DIRECTING A PULSED LASER BEAM ONTO A POSITION ON A SURFACE OF THE STRUCTURE FOR A TIME SUFFICIENTLY LONG TO VAPORIZE A PORTION OF THE STRUCTURE AT THAT POSITION. THE COMPONENT CAN ALSO BE A GAS DISTRIBUTOR HAVING AN ENCLOSURE WITH PLURALITY OF LASER DRILLED GAS OUTLETS [265] HAVING FIRST AND SECOND OPENINGS WITH DIFFERENT DIAMETERS TO REDUCE AN INGRESS OF A PLASMA INTO THE ENCLOSURE. THE LASER DRILLED GAS OUTLETS [265] CAN ALSO HAVE ROUNDED EDGES.
申请公布号 MY137727(A) 申请公布日期 2009.03.31
申请号 MY2003PI01274 申请日期 2003.04.07
申请人 APPLIED MATERIALS, INC. 发明人 WANG, HONG;HE, YONGXIANG;LIN, YIXING;WELDON, EDWIN CHARLES;STOW, CLIFFORD
分类号 B23K26/38;C23C16/44;H01J37/32 主分类号 B23K26/38
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