发明名称 |
Method for wafer level packaging and fabricating cap structures |
摘要 |
A cap wafer with patterned film formed thereon is etched through areas not covered by the patterned film to form a plurality of openings. Then, the cap wafer is bonded to a transparent wafer, and the cap wafer around the pattern film is segmented to form a plurality of cap structures. A device wafer with a plurality of devices and a plurality of contact pads electrically connected to the devices is subsequently provided. The cap structures and the device wafer are hermetically sealed to form a plurality of hermetic windows on the devices.
|
申请公布号 |
US7510947(B2) |
申请公布日期 |
2009.03.31 |
申请号 |
US20060428409 |
申请日期 |
2006.07.03 |
申请人 |
TOUCH MICRO-SYSTEM TECHNOLOGY INC. |
发明人 |
SHAO SHIH-FENG;CHIU MING-YEN |
分类号 |
H01L21/30;H01L21/46 |
主分类号 |
H01L21/30 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|