Surface mountable direct chip attach device and method including integral integrated circuit

摘要

A surface mountable chip comprises a semiconductor substrate having IC devices formed thereon and also vertically exposed electrical contacts formed as part of the IC fabrication substrate. Metallization lines electrically connect the IC devices with the contacts. The inventor also contemplates wafers having electrical connection vias in place on the wafers in preparation as a product for further fabrication. A method embodiment of the invention describes methods of fabricating such surface mountable chips.