| 摘要 |
A COF package and tape substrate therefore are provided to reduce the wiring of the semiconductor device by disposing the inner input electrode to the neighborhood of the ladder resistance. The COF package comprises the semiconductor chip(20) of square and tape substrate(10). The semiconductor chip is mounted on the tape substrate. The circuit-forming surface of the semiconductor chip is faced with the tape substrate. The tape substrate comprises the external input terminal(31), the external output terminal(32), the input wire(41), the output line(42) and the input wire(43). The semiconductor chip comprises the input electrode(51), and the output electrode(52) and the internal input electrode(53). The internal input electrode is arranged in the neighborhood of the ladder resistance(80). |
