ТЕРМОЭЛЕКТРИЧЕСКОЕ УСТРОЙСТВО ТЕРМОРЕГУЛИРОВАНИЯ КОМПОНЕНТОВ ВЫЧИСЛИТЕЛЬНЫХ СИСТЕМ С ВЫСОКИМИ ТЕПЛОВЫДЕЛЕНИЯМИ

摘要

FIELD: radio engineering. ^ SUBSTANCE: invention is related to radio electronics and may be used to normalise temperature of computer system components. Device comprises container with liquid, volume of which is separated by partition with a small hole and thermal module with heat sinks on hot and cold soldered joints. In process of operation thermal module from the side of hot soldered joint at temperature of liquid boiling transforms liquid into steam and at the same time removes heat from component. On the side of cold soldered joint thermal module transforms steam into condensate. Condensed liquid is returned through small hole into reservoir with boiling liquid and again boils, absorbing heat. ^ EFFECT: provision of temperature mode in heat-release component of computer system with high accuracy, reduced inertia of heat stabilisation process and provision of most efficient mode of operation. ^ 1 dwg