发明名称 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR DESIGNING MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A semiconductor device includes a semiconductor chip, a moisture resistant ring provided in the semiconductor chip and having a chamfered flat part in a position corresponding to a corner of the semiconductor chip, and a first monitor pattern formed inside the moisture resistant ring. At least a part of the first monitor pattern is disposed inside an n-sided polygonal area (n is a natural number which is 4 or higher than 4) situated within the moisture resistant ring, and outside a quadrangular area situated inside the n-sided polygonal area. The n-sided polygonal area has a vertex at least at each of a first end and a second end of the chamfered flat part, and the quadrangular area has a vertex at least at a middle point of the chamfered flat part.
申请公布号 US2009079039(A1) 申请公布日期 2009.03.26
申请号 US20080207922 申请日期 2008.09.10
申请人 FUJITSU MICROELECTRONICS LIMITED 发明人 FUJITA KAZUSHI;NANJO RYOTA
分类号 H01L23/58;H01L21/76 主分类号 H01L23/58
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