发明名称 |
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR DESIGNING MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device includes a semiconductor chip, a moisture resistant ring provided in the semiconductor chip and having a chamfered flat part in a position corresponding to a corner of the semiconductor chip, and a first monitor pattern formed inside the moisture resistant ring. At least a part of the first monitor pattern is disposed inside an n-sided polygonal area (n is a natural number which is 4 or higher than 4) situated within the moisture resistant ring, and outside a quadrangular area situated inside the n-sided polygonal area. The n-sided polygonal area has a vertex at least at each of a first end and a second end of the chamfered flat part, and the quadrangular area has a vertex at least at a middle point of the chamfered flat part.
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申请公布号 |
US2009079039(A1) |
申请公布日期 |
2009.03.26 |
申请号 |
US20080207922 |
申请日期 |
2008.09.10 |
申请人 |
FUJITSU MICROELECTRONICS LIMITED |
发明人 |
FUJITA KAZUSHI;NANJO RYOTA |
分类号 |
H01L23/58;H01L21/76 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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