| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip-chip mounting method detecting the crushing amount of a bump with a simple structure and improving the reliability of the connection between a semiconductor chip and a substrate. <P>SOLUTION: Bumps for circuit connection to be electrically connected to a processing circuit, and bumps for detection having a projection amount smaller than that of the bumps for circuit connection are formed on one surface of the semiconductor chip. Portions to be connected are formed on one surface of the substrate on which the semiconductor chip is to be mounted at the positions corresponding to the bumps for circuit connection and the bumps for detection respectively, the bumps for circuit connection are brought into contact with the portions to be connected, a load in the direction toward the substrate is imparted to the semiconductor chip, the bonding between the bumps for circuit connection and the portions to be connected is started, the contact between the bumps for detection and the portions to be connected is electrically detected, and the bonding is terminated according to the detection result. <P>COPYRIGHT: (C)2009,JPO&INPIT |
