| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition which allows a semiconductor element to be connected at a normal temperature by an ultrasonic wire bonding system, and to provide a semiconductor device that uses the adhesive composition. <P>SOLUTION: The adhesive composition is used for bonding of a semiconductor element having an electrode, which is to be electrically connected to a semiconductor element support member by the ultrasonic wire bonding system, and has a tensile modulus of elasticity of 0.1 to 4.0 GPa at 25°C, after curing and has a die shear strength of 10 MPa or larger. The semiconductor device has the semiconductor element bonded to the semiconductor element support member according to such a composition. <P>COPYRIGHT: (C)2009,JPO&INPIT |
