| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition giving a cured film having good solvent resistance and exhibiting high adhesiveness even in high-temperature high-humidity surroundings. SOLUTION: The heat-curable resin composition comprises (A) a polyimide silicone resin having phenolic hydroxy groups and radically polymerizable groups bonded to silicon atoms, (B) an epoxy resin in such an amount that a molar ratio of epoxy groups of the epoxy resin to the phenolic hydroxy groups of the polyimide silicone resin (A) ranges from 0.2 to 10, and a catalytic amount of (C) an organic peroxide. COPYRIGHT: (C)2009,JPO&INPIT
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