| 摘要 |
A substrate processing apparatus has a fluid supply means 20 for supplying fluid to a substrate W and a fluid collection means 21 for collecting the fluid in the vicinity of the substrate W, the fluid supply means 20 having a fluid spurt section 20a, the fluid collection means 21 having a fluid suction section 21a opening in the vicinity of the fluid spurt section 20a. Since the fluid collection means 21 suctions and collects the fluid floating around the substrate W as a result of the liquid having been supplied from the fluid spurt section 20a to the substrate W, it is possible to prevent the substrate W from being contaminated after the substrate W being processed with the fluid supplied from the fluid supply means 20.
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